US officials are wrapping up the year with a bevy of US CHIPS Act awards, including $4.75 billion to Samsung Electronics to support two new leading-edge logic fabs and an R&D fab in Taylor, Texas, and an expansion to the company’s Austin facility.
Samsung is investing $37 billion for the work in the next several years. US Secretary of Commerce Gina Raimondo said the Samsung award makes the US the only country that is home to all five leading edge semiconductor manufacturers.”We are unleashing the next generation of innovation, protecting our national security and enhancing our global economic competitiveness,” she said in a statement.
Last week, Texas Instruments was also awarded $1.61 billion under the Act, while Amkor Technology won $407 million, Sk hynix won up to $458 million, and Global Wafers up to $408 million.
The Amkor award was significant because of concerns about promoting advanced packaging domestically. Amkor will bring leading-edge packaging tech to the US for the first time, Raimondo said. The capability means the US won’t have to send chips abroad for packaging after they are made, Raimondo said.
Amkor is investing $2 billion in a greenfield advanced packaging and test facility in Peoria, Arizona.