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glass substrate

engineer in substrate packaging Gang Duian
Electronics

Intel names its inventor of 2024, Gang Duan

An engineer in substrate packaging, Duan has nearly 500 patents. His honor comes as Intel is undergoing a $10 billion cost-cutting plan.
Matt Hamblen Nov 18, 2024 11:40am
raimondo at an event

$1.6B competition aims to aid advanced packaging projects

Jul 11, 2024 11:14am
picture of golden glass sheet on manufacturing table

Glass substrates maker Absolics on track for $75M in CHIPS Act

May 23, 2024 10:20am

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